|
|
 
|
Sonics Achieves Breakthrough in SystemC-based SoC Modeling; New Versions of SonicsMX(R) SMART Interconnects(TM) Solutions and SonicsStudio(TM) Add Seamless SystemC to RTL Design Flow
MOUNTAIN VIEW, Calif.—(BUSINESS WIRE)—May 8, 2006—
Sonics Inc.(R), the premier supplier of system-on-chip
(SoC) SMART Interconnects(TM) solutions, today announces a new version
of its flagship SonicsMX SMART Interconnects solution featuring Open
SystemC Initiative (OSCI) compliant views, and a new version of
SonicsStudio, a tool used to configure Sonics SMART Interconnects
solutions such as SonicsMX, that generates consistent SystemC or RTL
versions of specific SonicsMX configurations.
One of the key breakthroughs associated with this announcement is
the ability for SoC developers to seamlessly migrate their
SystemC-based SonicsMX configurations into an RTL form ready for
functional verification and logic synthesis. The SonicsMX SystemC and
RTL models support a wide range of transaction level modeling design
techniques, enabling SoC architects to rapidly explore architectural
choices such as topologies, protocol choices, buffering,
quality-of-service (QoS), security, power management, and pipelining.
In contrast, traditional SystemC-based architectural approaches focus
purely on algorithmic and contention-oriented performance analysis,
leaving many key system and physical optimization issues for the RTL
design phase, which uses different methodologies. The new version of
SonicsStudio eliminates such risks when using SonicsMX.
"As SoC complexities continue to explode, and the interconnect
continues to move towards the centerpiece of the design, it's
essential that SoC architects analyze the performance and cost
tradeoffs of the interconnect as early as possible in the development
project," said Drew Wingard, chief technology officer, Sonics Inc.
"Sonics has already enabled its customers to make this shift with
earlier versions of SonicsStudio. The availability of SystemC models
for SonicsMX expands the SoC architect's exploration capabilities into
higher levels of abstraction, and by supporting seamless iterations
between SystemC and RTL views of SonicsMX, this new version of
SonicsStudio enables teams to also deploy ESL techniques
incrementally. This has a far reaching impact on the adoption of
SystemC modeling by SoC developers."
Sonics recently announced that SystemC versions of Sonics SMART
Interconnects solutions such as SonicsMX, that are suitable for
operation in the CoWare Inc.'s Platform Architect product, will be
available directly from CoWare Inc.
About Sonics
Sonics, Inc.(R) is the premier supplier of SMART Interconnects(TM)
solutions that deliver high SoC design predictability and increased
design efficiency. Major semiconductor and systems companies including
Broadcom, Texas Instruments, Toshiba, and Samsung have applied Sonics'
SMART Interconnects solutions in leading products in the wireless
communications, digital multimedia, automotive, and office products
markets. Sonics is a privately-held company funded by Cadence Design
Systems, Toshiba Corp., Samsung Ventures, and venture capital firms
Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt
Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information,
see www.sonicsinc.com.
Sonics and SMART Interconnects are registered trademarks of
Sonics, Inc. All other trademarks are the property of their respective
owners.
Contact:
Fast Forward PR (for Sonics Inc.)
Mary Jane Reiter, 408-725-1239
Email Contact
|
 Be the first to review this article
|
|
